Jetcool
Direct-to-chip liquid cooling
How does it work?
Transform thermal management in your high-power electronic application. Jetcool uses small fluid jets within compact cooling modules, transforming high-power electronic cooling performance at the chip or device level. Our patented fluid-to-package/fluid-to-die cooling techniques eliminate all thermal pastes and thermal interface materials, minimizing thermal resistance. Our modules are easily integrable and can handle the market’s highest power density devices. JetCool’s patented microconvective liquid cooling technology uses arrays of fluid jets to cool the industry’s highest power devices. Unlike typical heat sinks or cold plates that pass fluid over a surface, our cooling jets route fluid directly at the surface, creating an order-of-magnitude improvement in heat transfer.
Why is it needed?
High-power electronics are becoming smaller and more powerful. With more power, comes more heat. It’s now more important than ever for your cooling technology to augment, not limit, performance. Data centers are facing significant energy challenges. It is estimated that 3% of the planet’s total energy consumption is used by data centers with 30% of that attributed to cooling equipment. Engineers seeking to maximize compute density in high-performance computing applications are faced with thermally-bound constraints: heat causes processor throttling, hot spots, and limits device lifetime. Power and cooling are some of the most critical factors impacting mining profitability. Leveraging our expertise cooling the highest power devices, we’ve created a simple and affordable water cooling solution to help miners scale their operations.
How does it improve life?
Defense-grade cooling solutions help guard devices against downtime and network latency. Microconvective cooling™ technology cools devices to maintain optimal operational temperatures, improving device efficiency and lifetime. Our customers future-proof system design by reliably cooling the next three generations of processors, including those that exceed 1,000W per chip. For compute applications, our cooling technology reduces energy costs by up to 8% and water usage up to 90% annually while our blockchain customers save on infrastructure CapEx.